Wire bonder
Descrição:
The Kulicke & Soffa wire bonder, model 4700AD, is used to make micro-welds of gold wires (25 μm diameter) on metallic films. It can either be used as ball bonder or wedge bonder in samples up to 2x2 cm2 or in dual in line (DIL) chip carriers. The unit also has a microscope and a CCD camera.